序号 　标准编号 　标　准　名　称 　备 　注 　页 数 1 IPC-HDBK-001 HＡndbook Ａnd Guide to the Requirement for Soldered Electrical Ａnd Electronic Assemblies to Supplement ANSI/J-STD-001B 已焊接电子组装件的要求手册与导则 1998-03 Amend. 1 2000-12 135 2 SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology 精细节距带载自动安装技术概要 32509 3 J-STD-001 Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 1992-04 代替IPC-S-815 4 J-STD-001A Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 1995-01 5 J-STD-001B Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 1996-10 6 J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 2000-03 7 J-STD-001D Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 2005-02 69 8 J-STD-002 Solderability Tests for Component Leads,Terminations,Lugs,Terminals Ａnd Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 1992-04 代替IPC-S-805 9 J-STD-002A Solderability Tests for Component Leads,Terminations,Lugs,Terminals Ａnd Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 1998-10 10 J-STD-002B Solderability Tests for Component Leads,Terminations,Lugs,Terminals Ａnd Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 2003-02 11 J-STD-002C Solderability Tests for Component Leads,Terminations,Lugs,Terminals Ａnd Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 64 12 J-STD-003 Solderability Test for Printed Boards 印制板可焊性试验 1992-04 代替IPC-S-804 13 J-STD-003A Solderability Test for Printed Boards 印制板可焊性试验 2003-02 14 J-STD-003B Solderability Test for Printed Boards 印制板可焊性试验 39142 48 15 J-STD-004 Requirements for Soldering Fluxes锡焊焊剂要求 1995-01 代替IPC-SF-818 16 J-STD-004A Requirements for Soldering Fluxes锡焊焊剂要求 2004-01 20 17 SMC-WP-005 surface mount council white paper(pwb surface finishes) 49 18 J-STD-005 Requirements for Soldering Pastes 焊膏技术要求 1995-01 代替IPC-SP-819 31 19 J-STD-005 Amend.1 Requirements for Soldering Pastes 焊膏技术要求 34700 20 J-STD-006 Requirements for Electronic Grade Solder Alloys Ａnd Fluxed Ａnd Non-Fluxed Solid Solders 电子级锡焊合金及带焊剂与不带焊剂整体焊料技术要求 1995-01 21 J-STD-006A Requirements for Electronic Grade Solder Alloys Ａnd Fluxed Ａnd Non-Fluxed Solid Solders for electronic Soldering Applications 2001-05 28 22 J-STD-012 Implementation of flip chip Ａnd chip scale technology 倒装芯片及芯片级封装技术的应用 1996-01 120 23 J-STD-013 Implementation of Ball Grid Array & Other High Density Technology 球栅阵列(BGA)及其它高密度封装技术的应用(1996-07) 1996-07 103 24 J-STD-020 Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度/再流焊敏感度分类 35339 25 J-STD-020A Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度/再流焊敏感度分类 36251 26 J-STD-020B Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度/再流焊敏感度分类 2002-07 27 J-STD-020C Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度/再流焊敏感度分类 2004-07 18 28 J-STD-026 Semiconductor Design StＡndard for Flip Chip Applications 倒装芯片用印制板设计标准 1999-08 48 29 J-STD-027 Mechanical Outline StＡndard for Flip Chip Ａnd Chip Size Configurations 2003-02 20 30 J-STD-028 Performance StＡndard for Construction of Flip Chip Ａnd Chip Scale Bumps 倒装芯片及芯片凸块结构的性能标准 1999-08 36 31 J-STD-032 Performance StＡndard for Ball Grid Array Balls 球珊阵列性能标准 2002-06 17 32 J-STD-033 StＡndard for HＡndling Packing Shipping Ａnd Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表贴装器件的处置、包装、发运和使用 1999-04 33 J-STD-033A StＡndard for HＡndling Packing Shipping Ａnd Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表贴装器件的处置、包装、发运和使用 2002-06 20 34 J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜(1999-04) 1999-04 20 35 IPC-0040 Optoelectronics Assembly Ａnd Packaging Technology 2003-05 176 36 IPC-T-50F Terms Ａnd Definitions for Interconnecting Ａnd Packaging Electronic Circuits 电子电路互连与封装术语与定义 2003-12 37 IPC-T-50G Terms Ａnd Definitions for Interconnecting Ａnd Packaging Electronic Circuits 电子电路互连与封装术语与定义 111 38 IPC-SC-60A Post Solder Solvent Cleaning HＡndbook 锡焊后溶剂清洗手册 1999-08 48 39 IPC-SA-61 Post Solder Semiqueous Cleaning HＡndbook 锡焊后半水溶剂清洗手册 1995-07 已升至A版 32 40 IPC-AC-62A Aqueous Post Solder Cleaning HＡndbook 锡焊后水溶液清洗手册 1996-01 49 41 IPC-CH-65A Guideline for cleaning of Printed Boards Ａnd Assemblies 印制板及组装件清洗导则 1999-08 56 42 IPC-L-125A Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections 高速高频互连用覆箔或未覆箔塑料基材规范 被IPC-4103 代替 41 43 IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验 25 44 IPC-EG-140 Specification for Finished Fabric Woven from“E”Glass for Printed Boards 印制板用经处理E玻璃纤维织物规范 被IPC-4412 代替 无存档 32 45 IPC-SG-141 Specification for Finished Fabric Woven From “S”Glass for Printed Boards 印制板用经处理S玻璃纤维织物规范 20 46 IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed boards 印制板用经处理聚芳酰胺纤维编织物规范 17 47 IPC-QF-143 Specification for Finished Fabric Woven from Quartz （Pure Fused Silica）for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 20 48 IPC-CF-148A Resin Coated Metal Foil for Printed Boards 印制板用涂树脂金属箔 27 49 IPC-MF-150F Metal Foil for Printed Wiring Applications 印制板用金属箔 被IPC-4562代替 40 50 IPC-CF-152B Composite Metallic Material Specification for Printed Wiring Boards 印制线路板复合金属材料规范 33 51 IPC-FC-231C Flexible Base Dielectrics for Use in Flexible Printed Wiring 挠性印制电路用挠性绝缘基底材料 被 IPC-4202代替 29 52 IPC-FC-232C Adhesive Coated Dielectric Films for Use as Cover Sheet for Flexible Printed Wiring Ａnd Flexible Bonding Films 挠性印制线路和挠粘结片用涂粘结剂绝缘薄膜 被 IPC-4203代替 37 53 IPC-FC-234 PSA Assembly Guilelines for Single-Sided Ａnd Double-Sided Flexible Printed Circuits 单面和双面挠性印制电路压敏胶粘剂组装导则 31 54 IPC-FC-241C Flexible Metal-Clad Dielectronics for Use in Fabrication of Flexible Printed Wiring 制造挠性印制线路板用挠性覆箔绝缘材料 被 IPC-4204代替 35 55 IPC-FA-251 Assembly Guidelines for Single-Sided Ａnd Double-Sided Flexible Printed Circuits 单面和双面挠性电路组装导则 44 56 IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装技术印制板组装件设计导则 146 57 IPC-A-311 Process controls for phototool Generation Ａnd Use 照相版制作和使用的过程控制 18 58 IPC-D-316 Design Guide for microwave Circuit Boards Utilizing soft Substrates 高频设计导则 被IPC-2252代替 39 59 IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques 采用高速技术电子封装设计导则 83 60 IPC-D-322 Guidelines for Selecting Printed Wiring Board Size Using StＡndard Panel Sizes 使用标准在制板尺寸的印制板尺寸选择指南 14 61 IPC-MC-324 Performance Specification for Metal Core Boards 金属芯印制板性能规范 被IPC-6011 及 6012代替 33 62 IPC-D-325A Documentation Requirements for Printed Boards，Assemblies Ａnd support Drawings 印制板、印制板组装件及其附图的文件要求 94 63 IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies 制造印制板组装件的资料要求 已升至A版 16 64 IPC-NC-349 Computer Numerical Control Formatting for Drillers Ａnd Routers 钻床和铣床用计算机数字控制格式 16 65 IPC-D-356A Bare Substrate Electrical Test Data Format 裸基板电检测的数据格式 已被IPC-D-356B代替 66 IPC-D-356B Bare Substrate Electrical Test Data Format 裸基板电检测的数据格式 72 67 IPC-C-406 Design Ａnd Application Guidelines for Surface Mount Connectors 表面安装连接器设计及应用导则 48 68 IPC-CI-408 Solderless Surface Mount Connector Design characteristics Ａnd Application Guidelines 无焊接表面安装连接器设计及应用导则 46 69 IPC-BP-421 作废 70 IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Board 封入式分立布线互连板通用规范 43 71 IPC-DW-425A Design Ａnd End Product Requirements for Discrete Wiring Boards（includes amendment 1） 印制板分立线路的设计及成品要求（包括修改1） 53 72 IPC-DW-426 Specifications for Assembly of Discrete Wiring 分立线路组装规范 31 73 IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes 21 74 IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting Ａnd Interconnecting Electronic Components 126 75 IPC-DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards 钻柄直径1/8英寸的印制板用硬质合金钻头通用规范 17 76 IPC-DR-572A Drilling Guidelines For Printed Board印制板钻孔导则 32 77 IPC-TR-578 LEADING EDGE MANUFACTURING TECHNOLOGY REPORT 100 78 IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes in Printed Wiring Boards 印制板中小直径镀覆孔可靠性评价联合试验 90 79 IPC-WP/TR-584 IPC White Paper Ａnd Technical Report on Halogen-Free Materials Used for Printed Circuit Boards Ａnd Assemblies 40 80 IPC-WP/TR-584A IPC White Paper Ａnd Technical Report on Halogen-Free Materials Used for Printed Circuit Boards Ａnd Assemblies 40 81 IPC-A-600F Acceptability of Printed Boards 印制板验收条件(1999-11) 被IPC-A-600G代替 82 IPC-A-600G Acceptability of Printed Boards 印制板验收条件(2004-07) 140 83 IPC-QE-605 Printed Board Quality Evaluation HＡndbook 印制板质量评价手册 被IPC-QE-605A代替 84 IPC-QE-605A Printed Board Quality Evaluation HＡndbook 印制板质量评价手册 55 85 J-STD-609 marking Ａnd labeling of components,PCBs Ａnd PCBAs to identify lead (pb),pb-free Ａnd other attributes 86 IPC-HDBK-610 HＡndbook Ａnd Guide to IPC-A-610 （Includes IPC-A-610B to C Comparison） IPC-A-610手册及导则（包括IPC-A-610B 与 C的比较） 124 87 IPC-A-610C Acceptability of Electronic Assemblies 印制板组装件验收条件(2000-01) 被IPC-A-610D代替 88 IPC-A-610D Acceptability of Electronic Assemblies 印制板组装件验收条件(2005-02) 404 89 IPC/WHMA-A-620 Requirements Ａnd acceptance for cable Ａnd wire harness assemblies 346 90 IPC/WHMA-A-620修订版Ａ(中文) Requirements Ａnd acceptance for cable Ａnd wire harness assemblies线缆及线束组件的要求与验收 368 91 IPC-AI-641A User’s Guidelines for Automated Solder Joint Inspection Systems 焊点自动检验系统用户指南 作废 92 IPC-OI-645 StＡndard for Visual Optional Inspection Aids 目视光学检查工具标准 51 93 IPC-TM-650 Test Methods 测试方法 771 94 IPC-ET-652 Guideline Ａnd Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 被 IPC-9252 代替 25 95 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Board, Components Ａnd Materials 印制板、元器件及材料检验试验设备的认证 29 96 IPC-MI-660 Guidelines for Incoming Inspection of Printed Board Materials 144 97 IPC-7351A Generic requirements for surface mount design Ａnd lＡnd pattern stＡndard 104 98 IPC-PE-740 Troubleshooting for Printed Board Manufacture Ａnd Assembly 印制板制造和组装的故障排除 已升至A版 391 99 IPC-CM-770D Guidelines for Printed Board Component Mounting 印制板元件安装导则 已被IPC-CM-770E替代 100 IPC-CM-770E Guidelines for Printed Board Component Mounting 印制板元件安装导则 164 101 IPC-SM-780 Component Packaging Ａnd Interconnecting With Emphasis on Surface Mounting 以表面安装为主的元件封装及互连导则 168 102 IPC-SM-782A Surface Mount Design Ａnd LＡnd Pattern StＡndard（includes Amendment 1 Ａnd Amendment 2） 表面安装设计及连接盘图形标准（包括修订1和2） 228 103 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation 芯片直装技术实施导则 53 104 IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachment 表面安装焊接件加速可靠性实验导则 58 105 IPC-SM-786A Procedures for Characterizing Ａnd HＡndling of Moisture/Reflow Sensitive Ics 湿度/再流焊敏感集成电路的特性分级与处置程序 42 106 IPC-MC-790 Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则(1992-08) 107 IPC-S-816 SMT Process Guideline Ａnd Checklist 表面安装技术过程导则及检核表 46 108 IPC-CA-821 Genaral Requirements for thermally Conductive Adhesives 导热胶粘剂通用要求 17 109 IPC-HDBK-830 Guidelines for Design, Selection, Application of Conformal Coatings 印制板组装件用电绝缘复合材料的鉴定与性能 102 110 IPC-CC-830A Qualification Ａnd Performance of Electrical Insulating Compound for Printed Board Assemblies（with amendment 1） 印制板组装件用电绝缘复合材料的鉴定与性能（包括修改1） 已被IPC-CC-830B代替 111 IPC-CC-830B Qualification Ａnd Performance of Electrical Insulating Compound for Printed Board Assemblies（with amendment 1） 印制板组装件用电绝缘复合材料的鉴定与性能（包括修改1） 28 112 IPC-SM-839 Pre Ａnd Post Solder Mask Application Cleaning Guidelines 阻焊施加前及施加后清洗导则 25 113 IPC-SM-840C Qualification Ａnd Performance of Permanent Solder Mask 永久性阻焊的鉴定和性能 32 114 IPC-SM-840D Qualification Ａnd Performance of Permanent Solder Mask 永久性阻焊的鉴定和性能 24 115 IPC-HDBK-840 Sold Mask HＡndbook 82 116 IPC-D-859 Design StＡndard for Thick Film Multilayer Hybrid Circuits 厚膜多层混合电路设计标准 88 117 IPC-HM-860 Specification for multilayer Hybrid Circuits 多层混合电路规范 35 118 IPC-TF-870 Qualification Ａnd performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定和性能 30 119 IPC-ML-960 Qualification Ａnd Performance Specification for Mass Laminated Panels for Multilayer Printed Boards 多层电路板用预制内层在制板的鉴定与性能规范 25 120 IPC-1065 Material Declaration HＡndbook (For Users Ａnd Manufacturers of Printed Circuit Boards ) 72 121 IPC-1066 Marking , Symbols Ａnd Labels for Identification of Lead-Free Ａnd Other Reportable Materials in Lead-Free Assemblies , Components Ａnd Devices 20 122 IPC-1131 Information Technology（IT）Guide for PWB Manufacturers 印制板制造商用信息技术导则 20 123 IPC-1710A OEM StＡndard for Printed Board Manufacturers’ Qualification Profile印制板制造商鉴定提要的OEM标准 49 124 IPC-1720A Assembly Qualification Profile 组装认可概要(2004-07) 57 125 IPC-1730A Laminator Qualifier Profile 层压板制造商认可概要(2000-06) 39 126 IPC-1902 Grid Systems for Printed Circuits 印制电路网格体系 IEC 60097 8 127 IPC-2221 Generic StＡndard on Printed Board Design 印制板设计通用标准 已被IPC-2221A替代 128 IPC-2221A Generic StＡndard on Printed Board Design 印制板设计通用标准 124 129 IPC-2222 Sectional Design StＡndard for Rigid Organic Printed Boards 刚性有机印制板设计分标准 38 130 IPC-2223 Sectional Design StＡndard for Flexible Printed Boards 挠性印制板设计分标准 已被IPC-2223A替代 131 IPC-2223A Sectional Design StＡndard for Flexible Printed Boards 挠性印制板设计分标准 36 132 IPC-2224 Sectional StＡndard for Dsign of PWBs for PC Cards PC卡用印制电路板设计分标准 30 133 IPC-2225 Sectional Design StＡndard for Organic Multichip Modules (MCM-L) Ａnd MCM-L Assemblies 有机多芯片模块(MCM-L)极其组装件设计分标准 32 134 IPC-2226 Sectional Design StＡndard for High Density Interconnect(HDI) Printed Boards 51 135 IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits 100 136 IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) Ａnd Microvias 高密度互连(HDI)与微导通孔设计导则 40 137 IPC-2316 Design Guide For Embedded passive device printed boards 64 138 IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data Ａnd Transfer Methodology 产品制造数据及其传输方法学的通用要求 159 139 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 19 140 IPC-2547 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test,Inspection Ａnd Rework 56 141 IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Descripition Data Ａnd Transfer Methodology 166 142 IPC-2615 Printed Board Dimentions Ａnd Tolerances 印制板尺寸和公差 76 143 IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives 表面贴装导电胶使用指南 23 144 IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films 各向异性导电胶膜的一般要求 21 145 IPC-4101 Specification for Base Materials for Rigid Ａnd Multilayer Printed Boards 刚性及多层印制板用基材规范 已被IPC-4101B替代 146 IPC-4101A Specification for Base Materials for Rigid Ａnd Multilayer Printed Boards 刚性及多层印制板用基材规范 90 147 IPC-4101B Specification for Base Materials for Rigid Ａnd Multilayer Printed Boards 刚性及多层印制板用基材规范 120 148 IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 52 149 IPC/JPCA-4104 Specification for High Density Interconnect (HDI) Ａnd Microvia Materials 高密度互连（ＨＤＩ）及微导通孔材料规范 58 150 IPC-4110 Specification Ａnd Characterization Methods for Nonwaven Cellulose Based Paper For Printed Boards 印制板用纤维纸规范及性能确定方法 23 151 IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 20 152 IPC-4130 Specification Ａnd Characterization Methods for Nonwaven “E” Glass Mat 玻璃非织布规范及性能确定方法 23 153 IPC-4411 Specification Ａnd characterization Methods for Nonwoven Para-Aramid Reinforcement 聚芳基酰胺非织布规范及性能确定方法 已被IPC-4411A替代 154 IPC-4411A Specification Ａnd characterization Methods for Nonwoven Para-Aramid Reinforcement 聚芳基酰胺非织布规范及性能确定方法 32 155 IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 印制板化学镍/浸金镀层规范 40 156 IPC-4553 specification for immersion silver plating for printed circuit boards